Ball grid array package emulator
US5892245A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Nov 11, 1996 |
| Grant date | Apr 6, 1999 |
| Priority date | — |
| Expiry date | Nov 11, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/325
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An adapter is described herein which releasably connects a ball grid array package to a printed circuit board, or to a testing board, such that the ball grid array package may be reused. In a preferred embodiment, an inexpensive base of the adapter contains solder balls or terminals on its bottom surface in the same pattern as the solder balls on the bottom of the ball grid array package. The terminals protrude slightly through the top surface of the base. A conductive elastomer, which conducts in one direction only, is then placed over the top surface of the base of the adapter so as to make electrical contact with the protruding terminals on the base. A ball grid array package is then placed over the conductive elastomer such that the solder balls on the bottom surface of the ball grid array package electrically contact respective terminals on the base. To releasably secure the ball grid array package in place, a lid is placed over the adapter and secured to the base of the adapter with screws or a latching mechanism. If it is desired to provide external access to the leads of the ball grid array package or to the terminals on the printed circuit board, a test probe board, having…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.