Semiconductor device
US5892271A · kind A · utility
86Cited by
12References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 18, 1996 |
| Grant date | Apr 6, 1999 |
| Priority date | — |
| Expiry date | Apr 18, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A first bump is arranged on an electrode of a semiconductor chip. An opening portion formed at a position corresponding to an electrode on the semiconductor chip, a conductive lead subjected to patterning and arranged in the opening portion, and a second bump for being connected to the outside of the device are formed on a flexible substrate, and the conductive lead and the first bump are connected to each other in the opening portion. An external shape of the flexible substrate is approximately the same as that of the semiconductor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.