Patent · US Expired

Cooling element for electronic components

US5893409A · kind A · utility

20Cited by

3References

8Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Gerd Kohler · Munich, DE
Tobias Kirmse · Östringen, DE
Klaus Kohler · Eschborn, DE
Hans-Uwe Luckner · Regensburg, DE

Key dates

Filing date	Feb 27, 1998
Grant date	Apr 13, 1999
Priority date	—
Expiry date	Feb 27, 2018

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A heat sink for electronic components is presented, which is integral and comprises a strip of sheet brass. This strip is bent in a meandering shape, contact surfaces being seated on a heat distributor of a component, in the region of lower meandering curves. The heat sink is held firmly on the component by means of an internally produced prestress in conjunction with a snap-action connection. Although the heat sink has longitudinal elasticity even in the fitted state, its heat-dissipating function can always be maintained.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.