Apparatus for making wire connections on semiconductor chips
US5893509A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Apr 17, 1997 |
| Grant date | Apr 13, 1999 |
| Priority date | — |
| Expiry date | Apr 17, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T403/45
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In an apparatus known as a wire bonder, a new type of one-piece joint element (20) is used as the articulated link (G) between a support unit (pivoting rocker 30) and a bonding unit (10) that carries a capillary (12). One or more such joint elements (20) define a virtual pivot axis (A2) for the unit (10), which lies outside the unit and thus provides a passage in the apparatus wide enough for relatively wide workpieces (chips 1 on substrate 2). A joint element (20a) is made in one piece and has at least two elastically flexible blades (22a) converging toward each other relative to a symmetry plane (S), and the blades are connected to each other by two rigid sections (23a, 24a). One of the rigid sections (23a) is attached to (and removable from) the support unit (30), the other (24a) is attached to (and removable from) the bonding unit (10), so that the joint element (20) is easy to fit or exchange.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.