Method for manufacturing a massive parallel interconnection attachment using flexible circuit
US5893727A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 13, 1996 |
| Grant date | Apr 13, 1999 |
| Priority date | — |
| Expiry date | Aug 13, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12528
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of fabricating an electrical interconnect are provided. A first transparent dielectric layer is disposed on top of a support structure. A conductive circuit layer is plated above the first dielectric layer. Separate conductive layers are plated on top of the conductive circuit layer to produce conductive vias. A second transparent dielectric layer is disposed around the conductive layers. Contact tips are electrically connected to the top surface of the separate conductive layers. The interconnect may be visually aligned so that the contact tips brought into contact with target connections. In addition, the support structure may be partially removed to allow a flexible interconnect.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.