Method of heat treating a semiconductor wafer to reduce stress
US5893760A · kind A · utility
17Cited by
6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 26, 1997 |
| Grant date | Apr 13, 1999 |
| Priority date | — |
| Expiry date | Mar 26, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/931
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A susceptor in a semiconductor wafer heat treatment apparatus holds a wafer such that the wafer is made flat at a heat treatment temperature. In particular, the susceptor is constituted by an elastic platy member which is convex upward with respect to the direction of the gravity. Therefore, when the wafer is subjected to a high-temperature heat treatment, a crystal defect in the wafer can be suppressed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.