Process for applying a metallic adhesion layer for ceramic thermal barrier coatings to metallic components
US5894053A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Nov 5, 1996 |
| Grant date | Apr 13, 1999 |
| Priority date | — |
| Expiry date | Nov 5, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12097
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
In a process for applying a metallic adhesion layer for thermally sprayed ceramic thermal barrier coatings to metallic components, the surface which is to be coated being cleaned in a first process step, so that the metallic surface is free of grease and oxide, a binder is applied to the metallic surface of the base material in a second process step. Metallic adhesive powder is applied uniformly to the binder in a third process step and solder powder, which has a smaller particle size than the adhesive powder, is applied uniformly to the binder in a fourth process step. After drying the binder, a heat treatment is carried out for the purpose of soldering. The adhesion layers produced in this way are rough and provide a considerable positive lock for the ceramic thermal barrier coatings which are to be sprayed thereon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.