Jet soldering system and method
US5894985A · kind A · utility
35Cited by
27References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 24, 1996 |
| Grant date | Apr 20, 1999 |
| Priority date | — |
| Expiry date | Sep 24, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB22F2009/0836
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
An apparatus for depositing a selected pattern of solder onto a substrate on which electronic components are to be mounted. The apparatus includes a substrate support, a replaceable solder cartridge, and a solder ejector. The replaceable solder cartridge defines a cavity for containing solder and has an orifice for ejecting a continuous stream of molten solder. The solder ejector has a mechanism for retaining the replaceable solder cartridge during solder deposition and is positioned relative to the substrate support to deposit molten solder ejected from the orifice of the replaceable solder cartridge onto the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.