Process for manufacturing transponders of small dimensions
US5895235A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Oct 7, 1997 |
| Grant date | Apr 20, 1999 |
| Priority date | — |
| Expiry date | Oct 7, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/139
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A device, notably a transponder, comprising an electronic arrangement and a coating formed by an envelope defining a pocket and by a solidified binding in which is embedded the electronic arrangement. The envelope presents an opening having served for the introduction of the electronic arrangement and the binding during the manufacture of the device. The external surface of the device in the region of the opening is formed by the solidified binding. For the manufacture of the device such has described hereabove, it is envisaged to use a reservoir acting to fill the pocket by the binding and to recover a surplus of provided binding, this surplus of binding and the reservoir being separated from the device after the binding has at least partially solidified.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.