Process for manufacture of integrated circuit device
US5895263A · kind A · utility
136Cited by
29References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 19, 1996 |
| Grant date | Apr 20, 1999 |
| Priority date | — |
| Expiry date | Dec 19, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02282
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to a process for forming an integrated circuit device comprising (i) a substrate; (ii) metallic circuit lines positioned on the substrate and (iii) a dielectric material positioned on the circuit lines. The dielectric material comprises porous organic polysilica.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.