Chuck apparatus for substrate shaping
US5895529A · kind A · utility
6Cited by
6References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 19, 1997 |
| Grant date | Apr 20, 1999 |
| Priority date | — |
| Expiry date | Jun 19, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05C13/02
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
There is disclosed a chuck apparatus for holding and shaping a hollow, flexible, endless substrate during dip coating comprising: (a) a hollow, flexible bladder adapted to be disposed within the substrate; and (b) a first spindle and a second spindle which are partially disposed within the bladder, the second spindle being movable to press the bladder against the substrate and to shape the bladder and the substrate into an elongated shape.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.