Microelectronic assembly including polymeric reinforcement on an integrated circuit die, and method for forming same

US5895976A · kind A · utility

Assignee

• Motorola, Inc. · US

Inventors

• Michelle J. Morrell · Glen Ellyn, US
• Steven C. Machuga · Schaumburg, US
• Grace M. O'Malley · Hoffman Estates, US
• George Amos Carson · Elk Grove Village, US
• Andrew Skipor · West Chicago, US
• Wen Xu Zhou · Atlanta, US
• Karl W. Wyatt · Cary, US

Key dates

• Filing date: Jun 3, 1996
• Grant date: Apr 20, 1999
• Expiry date: Jun 3, 2016

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/09701
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A microelectronic assembly (10) includes an integrated circuit die (12) mounted onto a substrate (14) by solder bump interconnections (32). The die (12) and the substrate (14) are spaced apart by a gap (30) that is filled with a polymeric encapsulant (16). The die (12) includes a die perimeter (24) and a face (27) facing away from the substrate (14). A polymeric reinforcement (18) is disposed onto the die face (27) to protect the die (12) and to reduce the effects of thermally induced stresses on the die (12) and the solder bump interconnections (32). The polymeric reinforcement (18) is spaced apart from the die perimeter (24) to maintain a desired peripheral fillet geometry of the encapsulant (16).