Integrated circuit with a chip on dot and a heat sink
US5896271A · kind A · utility
24Cited by
6References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 21, 1997 |
| Grant date | Apr 20, 1999 |
| Priority date | — |
| Expiry date | Jul 21, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed is a flexible substrate having a thermal contact that provides a continuous high thermal conductivity path from a heat generating component to a heat sink. In one embodiment, the thermal contact includes a metallic trace including a raised feature of thermally conductive material. A solder ball or fillet may be used to make a connection between the raised feature and the heat generating component or between the raised feature and the underlying heat sink or both.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.