Equipment for cleaning, etching and drying semiconductor wafer and its using method
US5896875A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Aug 30, 1996 |
| Grant date | Apr 27, 1999 |
| Priority date | — |
| Expiry date | Aug 30, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An equipment for cleaning, etching and drying a semiconductor wafer is provided with a process chamber having a closed space of which temperature is capable of being heated and adjusted by a heater; a mesh arranged at the center part in the process chamber and supporting at least one semiconductor wafer to be cleaned; a plurality of spray nozzles arranged in line at the upper part in the process chamber; and a rotary discharge nozzle arranged at the lower part in the process chamber. The spray nozzles spray chemical and ultrapure water with nitrogen gas in mist state, and the rotary discharge nozzle blows out chemical and ultrapure water as jet stream by rotation of a first arm and second arms thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.