Resist develop process having a post develop dispense step
US5897982A · kind A · utility
12Cited by
9References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 5, 1996 |
| Grant date | Apr 27, 1999 |
| Priority date | — |
| Expiry date | Mar 5, 2016 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/3021
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A resist develop process involves the steps of dispensing a developer on a resist on a semiconductor wafer, forming the developer into a puddle where a portion of the resist dissolves into the developer, dispensing additional developer following development, rinsing the wafer with a rinsing agent, and drying the wafer surface. The additional developer dispense step replaces developer with resist dissolved therein with new developer prior to the rinsing step to prevent potential resist precipitation during the rinsing step which can lead to bridging.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.