Lead frame and semiconductor package
US5898212A · kind A · utility
17Cited by
2References
21Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 17, 1997 |
| Grant date | Apr 27, 1999 |
| Priority date | — |
| Expiry date | Jan 17, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A lead frame includes a first lead and a second lead formed on the first lead. The second lead may comprise a conductive adhesive and a conductive layer attached to the first lead. Such leads may be used for a package where the second leads are exposed on the outside exterior of a molded resin and/or a semiconductor chip has a plurality of center chip pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.