Method of mounting circuit components on a flexible substrate
US5898992A · kind A · utility
10Cited by
12References
29Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 24, 1997 |
| Grant date | May 4, 1999 |
| Priority date | — |
| Expiry date | Apr 24, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49149
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
This invention is concerned with improvements in or relating to methods of mounting circuit components on flexible substrates and, in particular, surface mounting components to the conductors of printed circuits on flexible substrates having relatively low temperature heat resistance using soldering techniques. A carrier assembly and the assembled circuits are also part of the invention.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.