Method for fabricating semiconductor wafers
US5899743A · kind A · utility
23Cited by
4References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 29, 1996 |
| Grant date | May 4, 1999 |
| Priority date | — |
| Expiry date | Aug 29, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/974
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for efficiently fabricating semiconductor wafers of good planarization without utilizing chemical solutions of high etching rate is disclosed. The method slices a single-crystal ingot into slices of wafers. The edge of each wafer is chamfered. A lapping step is carried out to planarize the chamfered wafer. Both side surfaces of the wafer are then polished. Next, the wafer surface is mirror polished. Finally, the wafer is cleaned.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.