Method and system to increase delivery of slurry to the surface of large substrates during polishing operations
US5899799A · kind A · utility
26Cited by
16References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 19, 1996 |
| Grant date | May 4, 1999 |
| Priority date | — |
| Expiry date | Jan 19, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B57/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Grooves are cut into an under pad of a polishing pad assembly formed by an under pad and an over pad. The grooves cause channeling of the over pad so that slurry received on the polishing face of the pad assembly is delivered across the pad assembly's surface in a controlled fashion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.