Method of depositing a dielectric onto electrically conductive elements
US5900282A · kind A · utility
4Cited by
8References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 20, 1998 |
| Grant date | May 4, 1999 |
| Priority date | — |
| Expiry date | Jan 20, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05D1/10
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of depositing a dielectric coating, comprising the steps of forming an unroughened or roughened, as-cast or wrought substrate surface to receive the coatings; and flame spraying a single premixed thermoplastic epoxy/hardener powder onto the surface, the resultant in-flight heated powder being chemically activated to impact the surface and form a chemically adhering coating, the coating being cured in-situ to be dielectric and thermally conductive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.