Patent · US Expired

Method of producing an attenuating structure on a surface wave component

US5900286A · kind A · utility

2Cited by

5References

11Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Heiner Bayer · Olching, DE
Walter Fischer · Reinach, CH
Winfried Plundrich · Kalchreuth, DE
Hans Stelzl · Vaterstetten, DE
Wolfgang Pahl · Munich, DE

Key dates

Filing date	Jun 5, 1997
Grant date	May 4, 1999
Priority date	—
Expiry date	Jun 5, 2017

Classification

Technology area (CPC G)Physics
CPC primaryG10K11/36
WIPO fieldOther consumer goods
WIPO sectorOther fields

Abstract

An attenuating structure composed of an epoxy resin which cationically cures with UV initiation is proposed for a surface wave component. The solvent-free epoxy resin is based on a cycloaliphatic epoxide and is applied to the wafer by screen printing. When the wafers are sawn up, sawing through can be carried out without detaching or splintering off the attenuating material. Attenuation and corrosion behavior of the attenuating structures fulfill the requirements for surface wave filters.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.