Composition for forming high thermal conductivity polybenzoxazine-based material and method
US5900447A · kind A · utility
12Cited by
3References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 1, 1997 |
| Grant date | May 4, 1999 |
| Priority date | — |
| Expiry date | May 1, 2017 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2003/382
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to a composition and method for forming a high thermal conductivity polybenzoxazine-based material. The composition comprises at least one benzoxazine resin and a filler material which includes particles of boron nitride in an amount sufficient to establish a thermal conductivity of between about 3 W/mK and 37 W/mK in the polybenzoxazine-based material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.