Denture adhesive including a solvent-free, high molecular weight terpolymer of maleic anhydride, a C.sub.1 -C.sub.4 alkyl vinyl ether and isobutylene
US5900470A · kind A · utility
9Cited by
7References
10Claims
0Family size
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Key dates
| Filing date | Jun 16, 1998 |
| Grant date | May 4, 1999 |
| Priority date | — |
| Expiry date | Jun 16, 2018 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K5/0008
- WIPO fieldPharmaceuticals
- WIPO sectorChemistry
Abstract
Denture adhesive including a solvent-free, high molecular weight terpolymer of maleic anhydride, a C.sub.1 -C.sub.4 alkyl vinyl ether and isobutylene.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.