Closed loop liquid cooling for semiconductor RF amplifier modules
US5901037A · kind A · utility
213Cited by
1References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 18, 1997 |
| Grant date | May 4, 1999 |
| Priority date | — |
| Expiry date | Jun 18, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A closed loop liquid cooling system for an RF transistor module including a plurality of elongated microchannels connected between a pair of coolant manifolds for conducting liquid coolant beneath one or more transistor dies to dissipate the heat generated thereby, a heat exchanger, a miniature circulating pump located on the module, and passive check valves having tapered passages for controlling the flow of coolant in the loop. The valves are truncated tapered passage microchannel valves having no moving parts and are fabricated so as to be a part of either the circulating pump, the coolant manifolds, or the microchannels.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.