Mounting device for electronic components
US5901039A · kind A · utility
67Cited by
10References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 16, 1997 |
| Grant date | May 4, 1999 |
| Priority date | — |
| Expiry date | Jul 16, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device for mounting a first element onto a second element to sandwich an electrical or electronic component therebetween, wherein the device is operable to cause the first element to exert a contact force on the component when the first element is mounted onto the second element and to couple the device to the first element in a manner which exerts a mounting force on the first element which is independent of whether the first element is mounted onto the second element. The first element may be a heat sink and the second element may be a printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.