Heat sink and Faraday Cage assembly for a semiconductor module and a power converter
US5901040A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 30, 1997 |
| Grant date | May 4, 1999 |
| Priority date | — |
| Expiry date | Jul 30, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention is a heat sink assembly for the removal of heat from semiconductor and power converter modules. The packaging design for semiconductor modules and power converter modules provides efficient heat removal and a tight Faraday Cage. There is a heat transfer layer sandwiched between a CPU module and a power converter module. The heat sink assembly includes a heat transfer layer, a fin stack, and a series of heat pipes. The heat transfer layer has a slot for passage of power cables and sense lines which connects both the CPU module and the power converter module, and the power converter module and the printed circuit board. The heat sink chamber also serves as a Faraday Cage and thus attenuates EMI from the semiconductor module, the power converter module, the power cables, and the sense lines.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.