Wired base plate and package for electronic parts
US5901050A · kind A · utility
63Cited by
5References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 21, 1997 |
| Grant date | May 4, 1999 |
| Priority date | — |
| Expiry date | Aug 21, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a wired base plate for an electronic part, an infinite number of metallic posts made of copper are provided to a lid joining section of a plural wire layer portion, which section includes a lid joining surface area to which a lid is joined. The metallic posts supports a pressure applied thereto from a lid at the time of mounting of the wired base plate on a circuit board and prevent the plural wire layer portion having a plurality of conductor wire layers and a plurality of resinous insulation layers, from being deformed by compression. A package for an electronic part having such a wired base plate is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.