Patent · US Expired

Semiconductor assembly with solder material layer and method for soldering the semiconductor assemly

US5901901A · kind A · utility

19Cited by

8References

3Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Manfred Schneegans · Vaterstetten, DE
Holger Huebner · Neustadt an der Aisch, DE

Key dates

Filing date	Feb 19, 1997
Grant date	May 11, 1999
Priority date	—
Expiry date	Feb 19, 2017

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/12812
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

In a semiconductor assembly with a solder material layer and a method for soldering the semiconductor assembly, a silicon semiconductor body with a diffusion barrier layer is provided with a solder material layer, preferably a tin layer. The semiconductor body is then applied to a metal carrier plate and is directly soldered to the carrier plate by heating to temperatures to above 250.degree. C., i.e. without further additions.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.