Self-adhesive stamps
US5902439A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 27, 1996 |
| Grant date | May 11, 1999 |
| Priority date | — |
| Expiry date | Sep 27, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/108
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Self-adhesive stamps comprising: a layer (2) of stamp paper bearing a printed stamp design on its front and having perfoated edges (6), a layer of pressure-sensitive adhesive (5) on the back of the stamp paper, and a peelable backing sheet (7) covering the adhesive, wherein the pressure-sensitive adhesive layer is patterned such that there is little or no adhesive adjacent to the perorated edges of the stamp paper. Preferably, the pressure-sensitive adhesive is a hot-melt adhesive, and preferably the adhesive is applied by printing. Also a method of making such stamps comprising the steps of: providing a sheet or web of stamp paper having lines of perforations defining stamps therein, followed by coating the back of the stamp paper with a patterned layer of pressure-sensitive adhesive and a peelable backing sheet.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.