Apparatus for bonding with a meltable composition
US5902445A · kind A · utility
0Cited by
12References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 11, 1995 |
| Grant date | May 11, 1999 |
| Priority date | — |
| Expiry date | Sep 11, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1798
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A machine for applying a heat meltable composition includes a drive module, a light source module, and a nozzle module. The drive module attaches to the end of an elongate arm for moving the material with respect to the nozzle. The light module includes a laser for irradiating the composition as it passes through the nozzle and is applied to the material. The nozzle includes a mechanism for withdrawing the composition after flow is terminated to prevent the formation of strings in the composition. The modules are controlled by a process that provides a sequence of steps upon receipt of control signals from an operator foot pedal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.