Method and apparatus for establishing a solder bond to a solder ball grid array
US5902495A · kind A · utility
2Cited by
9References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 22, 1996 |
| Grant date | May 11, 1999 |
| Priority date | — |
| Expiry date | Oct 22, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3494
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Apparatus and method for establishing a solder bond between a solder ball grid array and a circuit mounted on a substrate includes a bonding tool having a bonding tip for applying heat to the site of one or more of the solder balls in the solder ball grid array, a transducer for measuring displacement of the bonding tip during the bonding operation, and a signal generator responsive to the transducer for providing a signal indicative of tip displacement. The signal generated by the signal generator may be fed back to the bonding tool to optimize bonding parameters.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.