Liquid application method and method of manufacturing electronic devices using the same liquid application method
US5902648A · kind A · utility
39Cited by
3References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 22, 1996 |
| Grant date | May 11, 1999 |
| Priority date | — |
| Expiry date | May 22, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J9/2271
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention aims to form a thin coating film of even thickness within a short processing time under a curtailed consumption of coating liquid; where, a gas is spouted from nozzle 4 disposed facing to protection glass 2 of cathode ray tube, and a liquid containing fluorescent material is made to spout accompanied by the spouting gas, to be applied on protection glass 2 by shifting the positioning of protection glass 2 relative to nozzle 4 while spouting the liquid containing fluorescent material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.