Multi-layer laminate molding
US5902655A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 25, 1996 |
| Grant date | May 11, 1999 |
| Priority date | — |
| Expiry date | Nov 25, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2495
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
There is disclosed a multi-layer laminate molding having a layer structure that a main material layer made mainly of a polyethylenic resin at the outer side and an ethylene-vinyl acetate copolymer saponified product layer or polyamide resin layer at the inner side are laminated through at least an adhesive material layer, the adhesive material layer comprising a resin composition containing (A) 60 to 95% by weight of at least one resin selected from the-group consisting of (1) a high density polyethylenic resin having specified physical properties, (2) a linear low density polyethylenic resin having specified physical properties, (3) a modified high density polyethylenic resin obtained by grafting unsaturated carboxylic acid and the like onto the above (1), and (4) a modified linear low density polyethylenic resin obtained by grafting unsaturated carboxylic acid and the-like onto the above (2), and containing at least 0.1% by weight of (3) and/or (4) and (B) 40 to 5% by weight of a linear ultra low density polyethylenic resin having specified, physical properties said resin composition having a proportion of the unsaturated carboxylic acid and the like grafted of 0.001 to 50% by we…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.