Active wafer level contacting system
US5903164A · kind A · utility
7Cited by
5References
23Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 12, 1996 |
| Grant date | May 11, 1999 |
| Priority date | — |
| Expiry date | Nov 12, 2016 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2886
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Apparatus for use in testing a semiconductor device located on a wafer. The apparatus includes a wafer body. A device contact region is located on the wafer body. Further, an active component region is coupled to the device contact region. A mechanism is provided for coupling the active component region to a remote testing device. The active component region may include test signal conditioning circuits and device testing circuits. The active component region may be formed integral the wafer body by silicon wafer processing techniques, such as silicon doping.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.