Micro-patch antenna connected to circuits chips
US5903239A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 26, 1995 |
| Grant date | May 11, 1999 |
| Priority date | — |
| Expiry date | May 26, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15192
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An antenna apparatus comprises: a first chip having: a substrate; a ground film on the substrate; a dielectric film on the ground film; a micro-patch antenna on the dielectric film; a microstrip line extending from the micro-patch antenna; and an in/output microstrip line on the dielectric film; a second chip having a circuit for effecting an operation with the antenna; and a connecting portion for fixing the second chip to the first chip by providing mechanical and electrical connection (flip-chip bonding) between the circuit and the microstrip line and between the circuit and the in/output microstrip line. The substrate comprises a silicon, a GaAs substrate, or a dielectric substrate. The antenna may be provided on the bottom surface of the substrate and be provided on a third substrate also connected by the flip-chip bonding wherein the second chip and the antenna is connected using a through hole. Instead of the through hole, the antenna is coupled to the circuit portion electromagnetically. The substrate may have a hollow portion and the second chip may be accommodated in the hollow portion and the antenna may be provided on a third chip covering the second chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.