Laser diode package
US5903584A · kind A · utility
2Cited by
3References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 5, 1998 |
| Grant date | May 11, 1999 |
| Priority date | — |
| Expiry date | Jan 5, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/0683
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A surface-mounted flat package for a laser diode has the laser diode and light sensor diode mounted on top of a printed wiring insulating substrate. These diodes are connected to electrodes at the corners of the package. These electrodes may be fed through plated through via holes to form bottom electrodes. These via holes may be located at the four corners of the substrate or inside the edges of the package. For mass production, a matrix of laser diode and sensor diode assemblies are mounted on a common substrate. The substrate is sawed orthogonally through or outside the via holes to yield a large number of dice.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.