Die attach method and integrated circuit device
US5904504A · kind A · utility
3Cited by
9References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 19, 1998 |
| Grant date | May 18, 1999 |
| Priority date | — |
| Expiry date | Feb 19, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Die attach methods are provided. These methods include (a) providing a supply of die attach adhesive, (b) applying a portion of the die attach adhesive to a transfer member, and (c) contacting the lead frame paddle with the transfer member to print a layer of adhesive onto the lead frame paddle. Integrated circuit (IC) devices are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.