Use of preceramic polymers as electronic adhesives
US5904791A · kind A · utility
26Cited by
16References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 2, 1997 |
| Grant date | May 18, 1999 |
| Priority date | — |
| Expiry date | Jun 2, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A method of adhering an electronic component to substrate in which a layer of a preceramic polymer is applied between the electronic component and the substrate to which it is to be adhered followed by heating to convert the preceramic polymer into a ceramic. The method forms a strong bond which is not affected by the environment. The method is valuable for adhering integrated circuit chips to carriers or circuit boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.