Adhesive thermal interface and method of making the same
US5904796A · kind A · utility
77Cited by
25References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 5, 1996 |
| Grant date | May 18, 1999 |
| Priority date | — |
| Expiry date | Dec 5, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A thermal interface facilitates heat transfer from an electronic component to a heat sink. The thermal interface has a generally planar substrate formed of a heat resistant material having a layer of adhesive formed upon one surface thereof. A layer of conformable, heat conducting material is formed upon the other surface of the substrate. The other layer of adhesive facilitates attachment of the thermal interface to either an electronic component or a heat sink, as desired. The layer of conformable heat conducting material deforms so as to enhance heat transfer from the electronic component to the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.