Method for aligning and forming microelectromechanical systems (MEMS) contour surfaces
US5905007A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 1, 1997 |
| Grant date | May 18, 1999 |
| Priority date | — |
| Expiry date | Aug 1, 2017 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/24
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
An integrated circuit, or microelectromechanical structure is defined onto a contour surface by utilizing a flexible mask upon which photolithographic patterns are first defined using conventional planar photolithographic techniques. The contour surface is provided with a thin film uniformly distributed on the surface and then the flexible mask is aligned with the contour substrate. Alignments are made through multiple stages of yaw alignment, translation alignment and rotational alignment. Once the mask is aligned with contour substrate it is then subjected while rotating to developing field, such as uniform illumination of ultraviolet light shining on the side of the contour substrate as it is rotated in the illumination field. The developed photoresist layer disposed on the surface of the contour substrate is thus developed and the underlying film etched according to the patterned mask in a manner similar to a conventional planar photolithography. Multiple layers are thus disposed masked and etched to result in complex multilayered integrated circuit and/or microelectromechanical devices disposed on the contour surface of a macromechanical component or structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.