Low dielectric resin composition
US5905117A · kind A · utility
18Cited by
7References
17Claims
0Family size
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Inventors
Key dates
| Filing date | Sep 19, 1996 |
| Grant date | May 18, 1999 |
| Priority date | — |
| Expiry date | Sep 19, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31667
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A low dielectric resin composition comprising the following components (a) and (b), and the dielectric constant of a coating film formed by this composition being at most 3: PA1 (a) a resin having functional groups in its molecule and being soluble in a solvent; and PA1 (b) a partially hydrolyzed condensate of alkoxysilanes of the formula R.sup.1.sub.m R.sup.2.sub.n Si(OR.sup.3).sub.4-m-n, wherein each of R.sup.1 and R.sup.2 which may be the same or different, is a non-hydrolyzable group, R.sup.3 is an alkyl group, and m and n are integers of from 0 to 3 satisfying 0.ltoreq.m+n.ltoreq.3.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.