Moisture-curable hot melt silicone pressure-sensitive adhesives
US5905123A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 11, 1993 |
| Grant date | May 18, 1999 |
| Priority date | — |
| Expiry date | Jun 11, 2013 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/28
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A moisture-curable silicone hot melt pressure-sensitive adhesive composition is disclosed, said composition comprising PA0 (i) a solid hydroxyl-functional organopolysiloxane resin comprising R.sub.3 SiO.sub.1/2 siloxane units and SiO.sub.4/2 siloxane units in a molar ratio of 0.5/1 to 1.2/1, respectively, wherein R is selected from hydrocarbon and halogenated hydrocarbon radicals and said hydroxyl content is 1.2 to 6 percent by weight; PA0 (ii) an alkoxy-functional diorganopolysiloxane polymer having a viscosity at 25.degree. C. of 20 to <100,000 centipoise, the weight ratio of said resin to said polymer being in the range 40:60 to 80:20; PA0 (iii) a silane of the formula R'.sub.4-y SiX.sub.y, in which R' is selected from the group consisting of hydrocarbon radicals and substituted hydrocarbon radicals having 1-6 carbon atoms, X is a hydrolyzable group and y is 2 to 4, the amount of said silane being sufficient to provide stability to said composition; and PA0 (iv) sufficient catalyst to accelerate the cure of said composition, said composition being an essentially solvent-free, non-slump solid at room temperature which cures to an essentially non-tacky elastomer upon exposure to m…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.