Mold package for sealing a chip
US5905301A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 3, 1997 |
| Grant date | May 18, 1999 |
| Priority date | — |
| Expiry date | Feb 3, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package of the present invention comprises a base molded integrally with a lead frame by resin, a chip mounted on the lead frame, and a cap made of resin, which covers the chip and is fixed to the base. The base includes a substrate portion sealing the lead frame therein, a frame-shaped bank portion formed at a periphery of an upper surface of said substrate portion, the bank portion having said lead frame interposed between it snd the substrate portion, and an anchor portion formed at a portion of the lead frame interposed between the substrate portion and the bank portion. The chip is mounted on a region of the lead frame surrounded by the bank portion. The cap is fixed to the bank portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.