Method and apparatus for packaging a microelectronic device with an elastomer gel
US5905638A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 18, 1997 |
| Grant date | May 18, 1999 |
| Priority date | — |
| Expiry date | Dec 18, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/325
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An apparatus and method for packaging a microelectronic device to be connectable to a distribution circuit. The apparatus is in the form of a microelectronic package including a microelectronic device having first and second oppositely facing surfaces and a plurality of Input/Output pads on the first surface capable of being electrically interconnected to a distribution circuit, a base adapted to support the microelectronic device in a predetermined operative relationship to a distribution circuit, and a first layer of elastomer gel sandwiched between the first surface and the base. The first surface of the microelectronic device overlays the base so as to allow an electrical interconnection through the base between the microelectronic device and a distribution circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.