Ball polishing method and apparatus, and annular groove forming method
US5906535A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 27, 1997 |
| Grant date | May 25, 1999 |
| Priority date | — |
| Expiry date | May 27, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T82/16016
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A ball polishing method includes the steps of rotating one of two plates through use of a rotating mechanism while balls are sandwiched between the plates, pressing one of the two plates against the other plate via a guide slide mechanism for guiding one of the two plates to the other plate by means of a pressing mechanism, and polishing the balls while the pressing force is regulated through use of a pressing force control mechanism. The method is further provided with rotary support means for supporting the rotating mechanism and guide support means for supporting the guide slide mechanism, and at least one of them utilizes hydrostatics. By virtue of this method, a machining pressure can be controlled with a high degree of accuracy, and the accuracy of polishing of balls can be improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.