Method for the simultaneous curing of thermosetting resins
US5906782A · kind A · utility
7Cited by
8References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 24, 1995 |
| Grant date | May 25, 1999 |
| Priority date | — |
| Expiry date | Jul 24, 2015 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2045/468
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
In resin transfer molding, each mold cavity is charged initially with a hot curing resin system, then while the first resin is still uncured, successively injecting one or more resin systems which push the previous systems to the periphery of the mold. Each of said successive resin system curing at a lower temperature then the preceding system. Thus each resin system cures progressively faster than the previously injected resin system such that all resin systems cure at substantially the same point in time.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.