Polishing system for polishing wafer
US5908347A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 11, 1997 |
| Grant date | Jun 1, 1999 |
| Priority date | — |
| Expiry date | Apr 11, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23Q41/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In the polishing system of the present invention, a adhering unit adheres a wafer on a carrying plate using liquid. A polishing unit polishes the wafer using a polishing plate. A feeding unit conveys the carrying plate from the adhering unit to the polishing unit. A dismounting unit removes the wafer from the carrying plate. A first discharging unit conveys the carrying plate from the polishing unit to the dismounting unit. A cleaning unit cleans the vacant carrying plate. A second discharging unit conveys the carrying plate from the dismounting unit to the cleaning unit. A third discharging unit conveys the carrying plate from the cleaning unit to the adhering unit. The units are formed into a loop lines so that the carrying plate is circulated in the loop line and the wafers are polished therein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.