Metal foil with improved bonding to substrates and method for making the foil
US5908542A · kind A · utility
47Cited by
10References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 2, 1997 |
| Grant date | Jun 1, 1999 |
| Priority date | — |
| Expiry date | Jul 2, 2017 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D5/18
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
In one embodiment, the present invention relates to a method of treating metal foil, involving sequentially contacting a metal foil with an acidic solution; placing the metal foil in a nickel treatment bath and applying a current through the nickel treatment bath, wherein the nickel treatment bath contains at least about two plating zones, about 1 to about 50 g/l of an ammonium salt, and about 10 to about 100 g/l of a nickel compound; and applying a nickel flash layer to the metal foil. In another embodiment, the present invention relates to a metal foil treated according to the method described above.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.