Patent · US Expired

Method and apparatuses for measuring and correcting the stress profile of saw blades

US5908989A · kind A · utility

2Cited by
8References
10Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 5, 1997
Grant dateJun 1, 1999
Priority date
Expiry dateNov 5, 2017

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB23D63/18
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

A saw blade (10), in particular for band saws, is moved through a measuring path and a rolling path in a direction of travel (A) which essentially corresponds to its longitudinal direction, with two marginal regions of the saw blade (10) being supported on the measuring path-and held down in a start portion and an end portion of same and thus being held in a common reference plane which contains the direction of travel (A) and the saw blade (10) being lifted above the reference plane by a supporting force which is exerted only in the central area of the measuring path. The profile of the saw blade (10) is then measured in a measuring plane (B) which extends orthogonally to its direction of travel (A) in the center area of the measuring path, with data of the profile height relative to a chord which extends transversely to the direction of travel (A), coordinated with data of the distance of the measuring points from an edge (14) of the saw blade (10) and data of the longitudinal movement of the saw blade is stored. The saw blade (10) will be rolled in the direction of travel (A) region-by-region in accordance with this data.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.