Patent · US Expired

Vacuum-sealed field-emission electron source and method of manufacturing the same

US5909033A · kind A · utility

9Cited by
6References
8Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 10, 1997
Grant dateJun 1, 1999
Priority date
Expiry dateNov 10, 2017

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01J2329/00
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

A recess portion in a bowl-like shape is formed at the center of a silicon substrate, and plural cathodes are formed in a matrix with a predetermined distance therebetween on the bottom of the recess portion. Around each cathode on the silicon substrate, a withdrawn electrode is formed with an insulating film disposed therebelow. A first wire layer connected with the withdrawn electrode at one end extends along a slant side face of the recess portion and on the top face of a protrusion portion. A sealing cover in the shape of a flat plate of a transparent glass plate or the like is integrated with the silicon substrate with a circular sealing material disposed therebetween. A space formed among the silicon substrate, the circular sealing material and the sealing cover is retained to be vacuated.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.